No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.41 oz (40g)
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SMD291SNL40T7

DigiKey Part Number
315-SMD291SNL40T7-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
SMD291SNL40T7
Description
SOLDER PASTE IN JAR 40G (T7) SAC
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.41 oz (40g)
Datasheet
 Datasheet
Product Attributes
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Category
Flux Type
No-Clean
Manufacturer
Chip Quik Inc.
Mesh Type
7
Packaging
Bulk
Form
Jar, 1.41 oz (40g)
Part Status
Active
Shelf Life
6 Months
Type
Solder Paste
Shelf Life Start
Date of Manufacture
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Melting Point
423 ~ 428°F (217 ~ 220°C)
Base Product Number
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Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 0
1 past due; estimated in-stock on 28-Oct-2026
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Quantity
All prices are in USD
Bulk
QuantityUnit PriceExt Price
1$200.14000$200.14
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