The DDR5 Ultra Temperature DRAM module includes the following features: Chamfered PCB has edges trimmed at a 45-degree angle, making installation easier, and reducing the chance of catching on other parts or materials during installation and handling. The 45 µ” gold finger is thicker than the typical gold finger, helping the DRAM to withstand abrasion and friction over more insertion cycles and improving conductivity. The anti-sulfuration is a critical component for resilience in extreme environments because, under high temperatures, sulfur can build up, causing corrosion of metal parts and affecting the performance of electronic parts. The side fill enhances IC and PCB connectivity, protecting small solder points against thermal expansion and contraction that leads to PCB bending. Side fill makes the join stronger to resist the effects of external forces and reduce bending. Finally, the Micron ICs for automotive temperatures meet the grade two level of the AEC-Q100 automotive specification established by the Automotive Electronics Council for integrated circuits used in the automotive industry.